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Originally Posted by Albigger
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Have to think more but may be advantageous of two different setups:
Setup A: CPU with stock IHS, modified for a temperature measurement at the IHS surface. In theory both IHS and core (ondie) temp are known.
Setup B: Heat die with separate IHS, temp sensor in both die and IHS surface.
If results correlated between the two setups with the IHS on, the blocks could also be tested on the heat die without the IHS to indicate both IHS and bare-core perfomance?
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Many problems:
1) the power level would have to be matched (*very* hard to do)
2) you're not likely to be able to mount a temp probe within the heat die, to replicate what a CPU would return, due to physical limitations.