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Unread 12-15-2005, 03:26 PM   #7
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Join Date: May 2002
Location: Texas, U.S.A.
Posts: 8,302
Default Re: Die Simulator vs. CPU Article Discussion

What we need is a demonstration (proof) that the AMD internal TIM is variable.

Intel's internal temp probe is on the edge of the core (and therefore not representative), we know, which makes it a poor temp probe for CPU testing. TCC is not accessible (except as an on/off state). That leaves the IHS groove.

I also believe that the dynamics behind the IHS (Intel or AMD), physically, are a black hole. We could use more info there too.

I'll be pursuing the heat die route, on 10mm by 10mm, as well as 14mm by 14mm, with a floating, grooved, IHS; at least my mounting surface will be durable. I was planning to adapt the heat die to a dead motherboard; I'll see what can be done there.
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