Wow, I didn't expect this much response when I posted. I just threw the address out and expected to see one "Gee, isn't that nice..." Still, If one could bond a pillar or some predesigned shape directly to the die, and maybe drop a few C off the chip temps, one might be able to design waterblocks to take advantage of this extra heat spreading. Or Intel could give their chips a three-dimensional shape, allowing more heat dissipation by the inclusion of 4 more sides. I for one would rather see that than a 0.06% size reduction in die size. I'd bet this material could be press-molded into the desired shape, if it's merely a suspension of diamond in copper. Metals are generally disordered molecularly, aren't they? I can never remember.
|