if one looks at the vdfc, one can logically assume that the heat from the core will get spread out; the hotspot where water meets Cu will be larger, temp will be less.
what the vdfc will promote is the increase in water velocity over the chip area ; that will be a good thing.
the design could however be made to increase velocity, and have a small baseplate thickness over chip. chk out what puzzdre is doing in another thread. u could also make fewer connecting channels, and get narrower dremel wheels.
so there is a large difference between tec design and non-tec desing.
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