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bobo5195 · 06-15-2007, 12:26 PM

I remember me and bill used to yabber on about how hot spots on a die are a problem.

I know that intel showed some pics of huge variations over a p4 die.

In order to measure the effect you would need to measure the less conductive area over the CPU die (which is unknown) or a heat plot of the base of the device. You could in theory match a heat plot to a CPU heat plot to see what cooler is best as thermal paste should easentially be a 1D conductor is applied right.

How to measure heat effects like this is a hard problem for someone with hobbist grade equipment. I think that you could develop an approach with different heat distributions over various heat dies to try and approximate the effect and develop "a number" to take this into account.

Heat pipes have various effects along their length and production run application of conductive elements presents problems. I have a crazy idea brewing that heat pipes might effect performance by lowering the fourier time (time taken for heat to reach one point from another) which will effect small scale changes.

06-15-2007, 12:26 PM	#8
bobo5195 Cooling Savant Join Date: Aug 2005 Location: uk Posts: 400	Re: Discussion of heatsink designs I remember me and bill used to yabber on about how hot spots on a die are a problem. I know that intel showed some pics of huge variations over a p4 die. In order to measure the effect you would need to measure the less conductive area over the CPU die (which is unknown) or a heat plot of the base of the device. You could in theory match a heat plot to a CPU heat plot to see what cooler is best as thermal paste should easentially be a 1D conductor is applied right. How to measure heat effects like this is a hard problem for someone with hobbist grade equipment. I think that you could develop an approach with different heat distributions over various heat dies to try and approximate the effect and develop "a number" to take this into account. Heat pipes have various effects along their length and production run application of conductive elements presents problems. I have a crazy idea brewing that heat pipes might effect performance by lowering the fourier time (time taken for heat to reach one point from another) which will effect small scale changes.