Direct die cooling. Yes i know its been done but
- Use very small laser etched holes etched in plate - 100 microns or so
- Small holes mean very close to the block - 0.3 mm
- Small holes mean lots of holes about 0.3mm apart
- Need for a big ass pump to up performance
- exit points all the way around the side to prevent flow restriction
- Direct die with trying to optimise for hot points so stagger the holes.
Would suggest that if you mounted thermocromatics on the cpu surface with a clear top you could see where the hot areas were and optimise accordingly. Or just optimise for hte thermal sensor and cheat. You will half your C/W this way.