indeed yes.... the drawing is based on my initial development of the pin-grid area, that of cooling down high performance TEC's....
in the drawing the VDFC config is for uniform temp across a large square region....
with regards to cooling a Core sized region, it is still advantageous to have more copper directly over the core, that drawing will indeed do the job well, but there are other configurations, that work better...
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There is no Spoon....
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