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Originally Posted by nikhsub1
A little lesson in the Intel IHS's; they are CONCAVE by design. Leave it alone. The corners are supposed to be raised a bit, this ensures a good mount - ie; pressure on IHS to core.
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No, they are concav (or convex on some processors) because of a bad process and poor quality control ! IHS MUST be flat, datasheets are very explicit about that. We don't need to use elasticity and softness of the copper to make a good contact, this is an urban legend. If all parts are flat (core, IHS and base) and if a good pressure mounting is applied properly, all parts remains flat and contact will be *perfect* (core->IHS and IHS->base because vertical load is applied to whole system) ! Make a diagram and you'll understand, an numerical mechanical simulation could also show interesting visual results.
The reason to flatten out and polish an IHS is true and provide real benefits about temperatures (some degrees under load, easy to see under controlled situations). Sure, a concav IHS flattens out a bit under pressure, but it's always worst than a true flat one. The IHS center is the most important thing and if the HFS/WB don't touch it in a correct manner (too much thermal paste or air gap), perfs will be bad, even if WB touch correctly the 4 corners/edges... A non flat IHS always remains concav under load (we talk about small distances <<0.0x mm ) and the 4 marks under the WB are an evidence.