Introducing ... the Cuprinnock "Alpha 2"®
These prototypes were designed to clear the caps & toroidal coil around the mosfets, that is why they have open sides.
This design could easily be upscaled for use as Gfx memory or Northbridge
sinks. And could also be changed to accomodate more fins as well. Another smaller fin
piece could even be placed in the middle area. Which is the next design most likely.
In case you think that's solder joining the two pieces think again. That is
pure Silver.
Took a bit of patience, but I was able to pull it off quite successfully. The
VERY small difference in melting points between Copper & Silver made this
a fun challenge.
Among the premise behind this design are .........
1] very simple - both to produce and to upscale for cooling of larger chips
2] effective - to maximize the contact area from the base plate to the fin piece
3] durable - had to take high torch heat because of the use of pure Silver as a joining medium instead of solder
============================================
Took a small amount of experimentation with torch techniques to get the
Silver to flow evenly without heating the Copper too much. Only 220 degrees (F)
between the two melting points.
Must admit however, Copper has a wider MR (Melting Range) than Silver, which was to our
advantage here.
After this the pieces were cleaned in acid to remove all traces of the firecoat
and oxidation. Clean surfaces are extremely important! Even a minor fingerprint
can keep the two metals from joining properly.