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Originally Posted by unregistered
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consider the MCW55 data, now thin the bp; what would you expect ?
or is the MCW55 data flawed because it cools the IHS clad heat source effectively also ? (is that not the goal ?)...
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-From a designer perspective (i.e. reticular implant), I would expect different performance, but it could go either way. Too thin a bp could be detrimental. Optimal thickness would be better, but specific to a flow rate.
To quote the textbook:
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The TTV provides a well characterized tool suitable for simulating processor thermal behavior well before actual parts are available. A resistance-type heater band covers the surface area of the test die and is used to
simulate the heat generation of an actual processor core. The power dissipation is uniform across the test die and requires correction factors to account for non-uniform heat dissipation in an actual processor.
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TTV fuzzyland all over again.
Code:
Thermal Characterization Parameter Correction factor using Intel® Pentium® 4 Processor on 90 nm Process TTV
ΨCS 1.103
ΨSA 1.006
ΨCA 1.030
This data shows promise of an actual replication of a core. Is it so?
Ok will go with "blackbox".