Quote:
|
Originally Posted by unregistered
granting your definitions above, how do cu and ag differ wrt the heat transfer at their surfaces ?
i.e. what is the material property defining this characteristic ?
back to the graph
ok, you are showing a transient effect
what is its relevance ? (beyond the short term)
|
All calculations are with perfect heat transport from solid to liquid phase (no double layer constraints), that's the main bottleneck right now I think (as stated a few posts back).
The graph shows the steady state heat profile from the die to the cooling medium (assuming perfect heat dissipation between the transition layers). I've developed this toy model for evaluating the effect of the compostion of TIM on the cooling performance. Seems that for TIM the heat dissipation is also of more importance then the exact compostion with regard to heat conductivity, since the TIM (AS3 in this case) only contributes for 1% to the total delta T.