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Originally Posted by Huckleberry
Now here's an idea: why don't they make the die hexogonal? They might be able to sqeeze a few more viable dies from the edges.
Of course parting the dies from the wafer would require a small miracle...
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Should be easily doable. Require 3 cuts instead of 2. Turning the wafer and aligning it to 60° boundaries would be a cake walk for the sorts of manufacturning technologies CPU makers are using.
Where it gets a little dubious is the amount of wafer material lost due to the extra cut between the dies, and whether or not that results in the same number of usable dies out of a single wafer at the end of the day. For larger dies, it would definitely give higher yields.
Would present some interesting layout issues trying to place down rectangular cache grids onto the hexagonal die though.