Quote:
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Originally Posted by unregistered
how about an overlay ?
1) the CPU
2) TIM joint #1
3) IHS bottomside
4) IHS topside
5) TIM joint #2
6) sink underside
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1) and 2) The CPU and TIM were modeled as a single unit for this one. More RAM and more experience first, then ?
3) The heat input was uniform, the flux map would be essentially a square step-function. Temperature map?
4) That what I've shown, heat flow perpendicular to the IHS top surface
5)I haven't put lateral heat conduction in my TIM, so the flux map will match the IHS top.
6)Again a matching flux map, due to no lateral in the TIM. Temperature map?