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Originally Posted by BillA
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3 general methodologies described, testers select that which they wish...
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1- Die simulator
2- CPU based
3- Intel TTV
As I've stated before, I'm going the route of the Die simulator, with a free floating IHS.
The IHS gives my heat die a durable surface, and the heat die gives me a quantifiable (and control-able) heat source. 10mm by 10mm and 14mm by 14mm as die dimensions.