no Scott, you do not want the die temp to characterize the device thermal resistance
what you want is the 'sink-to-air' dT (or wb bp-to-coolant)
no matter what, you will have a TIM joint; Intel grooves the IHS and includes the joint, AMD grooves the sink excluding it - net effect is the same after calculation
both methods are imperfect, but understood
the die temp is a fiction
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