[BillA]

yes, this would have to be simple to and past the point of losing some data

lets consider kit and component testing apart

kit testing:
1) some reality in "C" is essential, I would opt for grooving the IHS
not hard to qualify TC thermal connection
- cons: not cheap, groovemust be 'on spec'

2a) Watt determination is not possible w/o GOOD flow rates and high res/accuracy temps
-> by virtue of the needed equipment, I have no difficulty in saying that the calculation of the heat load is outside of the normal review site's capability
- need a dyno to test engines, eh ?

2b) quite agreed, if most reviewers understood the (unobserved) variations in their air temps I suspect they would not publish
-> but we could define a procedure, no ?

keeping kits apart from components, I see no technical difficulties in kit testing with a 'qualified mobo/CPU/TC TIM joint'

component testing requires a separate determination of essential parameters
where, for example, a procedure calls for the determination of the flow rate, differential pressure, or small temperature differences then I (again, sorry) would say clearly that such testing is outside the province of those not having suitable equipment

my thought was to define an acceptable means of testing with a CPU,
not at all to 'qualify' CPUs as a source (alone) that would then enable anyone to test anything, right tools for the job