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Originally Posted by SysCrusher
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Yeah, it's like with HP's idea of direct die open air evsporstive CPU die cooling using their piko droplet technology and ultra clear coolants leaving no residues over the hottest parts of silicone. Strangely enough nobody ever heard of it again
The coldet spots are cache areas (memory as we all know do not heat up much). The rest is a mixture of controllers and logic arrays.
Well, the best idea would be to have silicone sandwiching layer through which w could pass veru low energy atoms on much smaller than copper size creating effectively in-die nano cooling solution (quite similiar to Peltier Effect
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