Quote:
Originally Posted by AngryAlpaca
Why did you choose this baseplate thickness? What's stopping you from using a thicker one?
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An increased cost of conduction is why. As Les's graphs illustrate, when the rate of convection get significantly above 50000W/m²K, base-plate thicknesses below 2mm are pretty much required to get the most out of the design - eventually the copper starts to get in the way. The higher the rate of thermal convection immediately above the CPU die, the less the lateral thermal spread, until eventually all the copper is doing is just getting in the way, rather than actually aiding in any significant fashion.