[BillA]

welcome to the party Ben
so a tester will groove the CPU used as a heat source/overclocking basis and bond in a 40ga TC,
not a die temp but perfectly usable (the scale will be compressed compared to the silicon temp)

EDIT
it just occured to me,
do you guys understand that the Intel thermal limits are based on the case (IHS) temp ?

this die temp stuff is not necessary to effective cooling as such is a consideration in package design, for thermal mgmt Intel defines the case temp as the basis of many calcs (AMD grooves the sink so their reference is the other side of the TIM joint, the sink or wb bp - probably a relic of their bare die days)