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Originally Posted by ibmkg
I guess you should have patented your design.
I wonder how they fused the two metals together. And what if I use Cu fins and solder them (from front i.e. where the water is going to flow, not from the back). And eventually lap its back i.e. processor contact area.
And perhaps use silver bearing solder. And how about thermal epoxy for bonding?
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Without having one of those in hand I can imagine they presoldered the tips of the pins and inserted them in the holes and heated the block up to melt the solder and bond the material. The amount of pins they have in that area is pretty good. Being they lapped it the IHS should make good contact with most of those pins directly instead of going to copper then solder then silver.
The problem with soldering on a fin is the solder is not nearly as good for heat transfer as a solid piece. Even the the solder is silver based. Also it is hard to keep the solder off area you don't want it. You can sure try it though and see what happens.
Stay away from epoxy if at all possible. Never had good luck with it in water cooling.