So, why not just use a copper slug shaped like an athlon 64 x2 die set up to give off 100 watts or whatever makes you people tick? Seems a lot simpler and its one of the largest dies we'll encounter for a long time (possibly ever)
All that matters is die temp, regardless of what is between the waterblock and the die. Our final goal is to cool the die; to measure the temp of something else to determine whether or not a cooling solution is any good is purely insane. The purpose of our cooling solutions is to get die temperature as low as possible, not IHS temperature. True, IHSes are becoming a fairly permanent item, but they still don't matter in a block's performance. Also, even Intel says that the TTV is for one thing: determining whether or not a heatsink will keep a chip from overheating or not. Not determining waterblock c/ws to within.1 degrees C. Even Intel says that other systems should be used in addition to the TTV to simply certify a heatsink as not-gonna-nuke-your-system.
Bill, why are you so hopelessly defending a mediocre system that doesn't even give us what we want? All it does is cast doubt across all of Swiftech's numbers, doubt that is clearly exemplified in a 6-page thread about a new block, 5 pages of which are a debate about whether or not the numbers are meaningful.
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