[davidzo]

nice looking block, but it looks like very much affort for only ok performance.
the cooling area is to big.
The effective surface where you should cool the block ist about 14*14mm in the middle of it, depending on which processor core is under it.
The rest of the block has nothing to do with its cooling capability, so you should keep the restrictivity very low.
The water should flow trough the channels very fast, the faster it hits the copper walls of the channel, the better it cools. But trough which channels? Not trough the channels which don't really cool effectively because theuy are a many milimeters away from the die. If the most water flows trough channels which are not really used to cool the cpu, the flow in the important channels in the middle is less high as it could be. So a more restrictive block, but effective block can be better than a less restrictive where the water is flowing anywhere but not where its hot.
Most commercial Blocks out there have the same problem, their cooling surface is not optimized for the real diesize and they are simply too restrictive. I bet a swiftech mcw6000 would be a few k better if it would be half as big, has only pins on a surface of 14*14mm and would have half the height to increase friction on the baseplate.

Try some round shaped jets, that could give you some nice performanceincrease if you place them right.
Try to design the block for your barton, an jetpattern with the size of 15*10mm would be a fine choice then. The cooling structure on the base would be something like 17*12mm.
The pattern looks ok, but i would try some smaller holes, less thick material and less thick effectivebaseplate.
The key to good performance is a very small thermal resistor of the block.
The idea behind this is a direct die cooler. The advatage of a good direct die cooler is, that it can save about 5k (depending on cpu) only because of the missing thermal gerase and missing 1mmthick copperplate which is isolating the hot cpu.
The advantage of a CPUblock is that it can increase the surface of the cpu.
So to combe this two important facts, we must try to find a pattern which maximises the surface and has a very small thermal resistance (e.g. small baseplate thickness).
Many cooling designs only maximise the surface without thinking on the resistance of a thick copper plate. Thats the point where the cascade SS gets its power from. Inside the cups, the silver baseplate is so thin, that the thermal resistance of the heatsink is almost 0.
The baseplate must be at least 2mm thick to make it stable. But you can use a few tricks to get it thinner where it should be thin. One of this tricks is to cut wholes into the bp like cathar does it whitch his cascade.
Another is it, to create a micro pinpattern, where the pins support the thin baseplate that it cant bend under the pressure of the mounting.
Another point of baseplatedesign is the flow. Flow simply means to get as much water as its possible there, where it is needed (directly on the small hotspot) an to get it away from there without much restriction.
Many designs have the problem, that the flow is not enough devided and there where it is needed.
A Jet pattern whith many small jets helps to direct the water directly an exactly to where it is needed.

Try to think on this ideas. You could save time, money and work an get a better cooling result with obeying this advices.