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Originally Posted by jaydee
Yup. This is why I don't understand/like the taking of the IHS temp only. It would be nice to see how well our dies are being cooled as well as the IHS. Also that image would very from block to block being the cooling area inside the blocks are not all the same.
More reasoning IMO to stick with die sim.
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The IHS temp measurement (Intel style) is easy to do, and can be done by anyone else, in the same way; that's why it's so tempting.
Otherwise the simulated core temperature can be calculated by an offset (which granted isn't easy to quantify, but not impossible).
So JD, what clamping pressure will you be using?:sneaky:
I'm thinking about an Intel-style temp measurement, using a die simulator without an IHS.