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Originally Posted by bigben2k
The IHS temp measurement (Intel style) is easy to do, and can be done by anyone else, in the same way; that's why it's so tempting.
Otherwise the simulated core temperature can be calculated by an offset (which granted isn't easy to quantify, but not impossible).
So JD, what clamping pressure will you be using?:sneaky:
I'm thinking about an Intel-style temp measurement, using a die simulator without an IHS.
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I don't use Intel and probably never will unless AMD goes under. I have no interest in testing under Intel conditions.
Clamping pressure? Was using 25lbs. Not sure what the new AMD CPUs are recommended at. Probably 50? The stock HS I just put on my sempron 2500+ Socket 754 was amazingly hard to lock down. Has to be a lot of pressure. Already having nightmares thinking about getting that thing off not to mention the thermal paste suction effect. The HS fits perfectly in the little square and cannot be moved side to side to break the suction....
At this point I am just about to the "**** testing" stage again. Getting to ridiculous.