WB Design, How about this one?
I am going to make a new WB for my Intel 3.2Ghz HT, LGA775.
This block consists of two materials, Al and Cu. Cu would be in contact with the processor. At the contact end there is sort of 'step' for LGA775. Cu would have tracks whose specs are:
Cu dimensions 76 x 51 x 13 mm (raw)
Width after facing Cu on each side =11mm
Cu (inner side)
Depth of track for Faced Cu (assuming 11mm) = 9mm (for raised die area) 7mm (for non raised)
Width of each horizontal track =2mm
Width of main track (vertical) would be proportional to barbs (~8mm )
Cu (outer side)
Die area proportional to CPU(less but not greater than CPU).
Raised die area =2mm
--------------------------
Al is to provide the service of an instant radiator. One side is like a heat sink and other (inner side) will have tracks but with less depth than Cu, thus forcing water to circulate in Cu easily. Al specs:
1inch Al. 25.4 mm
Al (inner Side)
Depth of tack <= 4mm.
Width of each horizontal track =2mm
Width of Main track (vertical) would be proportional to barbs (~8mm )
Al (outer side)
Heat Sink
Fins (track depth) 19.4mm.
Fins width <=4mm
Two holes size proportional to barbs.
-----------------------------------------------------------------------
The Al would have mounting holes for LGA 775 and for Cu. If the info provided does not make sense, reply me and I shall clear it up accordingly.
I need suggestions. Please do reply.
|