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Originally Posted by Incoherent
......This is exacerbated by TIM variations etc. which I have not modelled at this point. (too complex in a hurry) and even more significant with thin vs thick bases, concentrated cooling regions bla bla....
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Post122
Possibly ,even,an understatement.
An illustration using simple ,possibly inappropriate,Waterloo approach
Only exploratory thoughts using simple h(eff) profiles.
Suspect that real profiles are more complex.
Particularly,for comprehension of Apogee data,that of the single inlet onto pin array
However,
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Originally Posted by unregistered
a spiral should do as well with that mounting access
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possibly a spiral would do nearly as well in reality for modern CPUs where high Watt concentrates can develop.
Know SFA about CPUs however it is possible that it is the control of these local high flux densities that concerns the processor developers.
Maybe they do not care a monkey's 8888 about the performance of a Heatsink on a 10+ sq mm Heat Die.
May still be all about TIM.
Would classify an IHS as a TIM with HeatSpreading properties
Incoherent
Good to see some progress on flux and temperature modelling for the Flux-die.
Am mid-stream between rads and wbs and having focusing problems.
I have not yet formulated anything worth posting in the
Flux-die thread.
Anyone have the real dimensions of the Swiftech MCW6000?
Edit1: Have graphs for intermediate dies an other wb models: may post as attachment later.
Edit2: Added attachment: Resistance vs Die-area graph