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Heatsink/ Heat Pipe / ThermoSiphon Cooling The cat will only make the mistake of putting its paw by your HSF once. :) Also the place to discuss the new high end heat pipe goodness. |
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#51 |
Thermophile
Join Date: Oct 2001
Location: Nuu Zeeelin
Posts: 3,175
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yeah, now almost every newly released heatsink that performs worth a damn has copper in it
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#52 |
Thermophile
Join Date: May 2001
Location: UK
Posts: 1,064
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Wow where'd this shit spring back up from.
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#53 |
Thermophile
Join Date: Oct 2001
Location: Nuu Zeeelin
Posts: 3,175
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hehe, either way, it is a decent thread
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#54 |
Cooling Neophyte
Join Date: Jan 2002
Location: Eagle, WI
Posts: 21
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why not make a copper base heat sink (cuase copper is more dense) THEN attach that to AL fins! to get rid of the heat faster? cuase it's like more holy n stuff.
![]() I like Zalman heatsinks, they are pretty and they are quite. ben tha one leg pimp. |
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#55 |
Thermophile
Join Date: May 2001
Location: UK
Posts: 1,064
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What like a swifty MCX462?
![]() As for Al fins - they're for weight, dissipation is the same between Al and Cu.
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Once upon a time, in a land far far away... |
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#56 |
Cooling Neophyte
Join Date: Mar 2002
Location: florida
Posts: 25
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bump, carbon foam kicks silver, copper, or aluminums butts. problem is it's porous good for heatsinks bad for waterblocks
cabon foam |
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#57 |
Thermophile
Join Date: Oct 2001
Location: Nuu Zeeelin
Posts: 3,175
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more importantly it costs some serious dollars. I think it would be fine to use in the channels of a water block though
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2x P3 1100's at 1400, Abit VP6, 2x Corsair 256mb PC150 sticks, 20gb 'cuda ATA-III, 2x 40gb 'cuda ATA-IV in raid 0. 20" Trinitron. No fans 2x 2400+ at 2288mhz (16.0 x 143), Iwill MPX2, 2x Kingmax PC-3200 256mb sticks, 4x 20gb 60gxp in Raid 5 on a Promise SX6000. Asus Ti4200 320/630. Cooled by Water |
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#58 |
Cooling Neophyte
Join Date: May 2003
Location: Istanbul
Posts: 13
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Stuck in thread, coincidentally.
If someone reads the whole posts today, he/she will indicate that all the story is related with some area/weight ratio and some thermal conductivity. Cu "became" the future in HSFs. Sure. Of course. Certainly. Easy to understand "now". How is that "easiness" possible in only 1-2 years? Is it increase in knowledge, technology or just evolution ![]() |
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