Re: IHS or not?
 

Well I was thinking that would kind of be the point. Collect CPU case and CPU die temps while cycling system and then while remounting regularly and just watch the joint degrade. Or do we all concede it happens and don't care about the magnitude of the effect?

Re: IHS or not?
 

I have never contested the described degradation of the AMD Tim1 joint, but any test data of that joint cannot be extrapolated to the 775 Tim1 joint as they are different - and very much so

you may not see a gradual decline, also possible is an abrupt shift in temps due to the IHS being (eventually) pulled loose
and after a single test, . . . .

Re: IHS or not?
 

BillA: skip this.

Heh.

Preparing a CPU for testing with IHS: Remove IHS, clean away all TIM joint material. Take clean IHS and fill with thermal paste with thermal properties equivalent to AMD TIM. Fill past normal IHS enclosed volume and take care not to leave any air pockets. Place paste-filled IHS on clean CPU and press firmly. Wipe away excess paste from IHS edges. Seal IHS edges to package with epoxy.

Now you've got a CPU with IHS that should be able to handle any number of remounts. True, the properties will be different, but I don't see why you couldn't get a good match. It's up to the tester to find the right paste, which may not exist. Also, the IHS flex will probably change.

Re: IHS or not?
 

koslov
why not run that 'bare die' poll ?

Re: IHS or not?
 

Poll:
http://forums.procooling.com/vbb/showthread.php?t=12531