on the other hand, if you are putting effort into making a good testbed, you might as well future proof it and go 754.

I thought 754 was dying out and 939 was the way of the future

If I recall the last (hell, soo many changes) roadmap it was that 754 would stay the single channel (duron/sepron, mobiles, and possibly standard (re non-poweruser) A64s) and the 939 would be the dual channel workstation and desktop replacement mobiles while the 940 would stay on as the dual channel server (gotta love that registered crap.)

But I'm very possibly wrong and I'm more than likely out of date and just half remember a conversation.

If you have better info let me know.

From an enthusiast point of view, S939 is the way forwards.

S754 will effectively become the budget/low-end platform of the AMD line up to replace Socket A.

It would seem to me that it would make most sense to follow S939 from this point in time. S754 as a "flagship" enthusiast platform is effectively over, or at least will be within 2-3 months as availability and pricing gets better.

that's my (very limited) understanding as well

But both socket shares same mounting holes and very close packaging dimensions: total heights, length and width and thickness of IHS, as well as thermal output?

I need a DTR A64 CPU, anyone got the height of that bare CPU silicon?

Yeah, 939 will probably be the defacto standard for real power, unless the rumor about them changing sockets AGAIN when the release the DDR2 Cpus.

I think nikisub1 pops the lids of his CPUs, perhaps he would know that dimension

He's an Intel user though. Possible to just look at the tech documents for the AMD64-mobile maybe?

Right. Intel at this point.

yea, then make the assumption that . . . .
better a measurement I think