My diesim
Hey guys, I got my die simulator made, its the squairish one in th back behind bigbens. I now have to figure out how I want to insulate this thing.
http://jfettig.wc101.com/diesim/1.jpg A little more info here: http://www.wbta.us/forums/index.php?showtopic=50&st=0 Jon |
Is the hole for temp probe in the center of your die?
Bill suggests phenolic resin 2" thick for insulation. Pricey though! |
and yesterday my MCW6000 played copper kettle, 177°C
PAY ATTENTION |
ouch!
So you were playing with a dual core Prescott? LOL |
no, I have burned up/melted down this poor abused heat die 3 or 4 times
sometimes equip failure, this time my (operator) error - no circulation, boiled then blew up but yea, high heat loads |
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Are we any nearer to agreeing on a standard die size, sensor location, copper appears to be the material of choice. . |
if that hole is close to the die face, it will have a definite impact on the heat flux
better would have been to test w/o a hole, establish a baseline, then drill or grove the die and re-measure for the offset Inchoerent I would suggest not using inputs from 'the geek' to establish a consensus re testing equip and procedures Jon's program/aspirations/intended accuracy is somewhat limited, much more so than with pH or JoeC (let alone Swiftech - and now other mfgrs are doing sophisticated testing as well) |
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Is your "sensor location relative to die surface" still 2mm? This needs to be standardised |
some guys who know a whole lot more than I do about testing looked at the die setup and concluded that it was reasonable - for what it is intended to do; provide a 'calibrated' heat source
no assessment was made of the accuracy or correspondence between what I measure as the 'die temp' and the actual die face temperature, just the measurement's repeatability an offset ledge can be used as I do, or a groove cut on the face, or a hole drilled as Jon did all will work, each will have a different temp offset I think, before dimensions, an agreement is needed (or not ??) on where to place the sensor one might also ask agreement between whom ? |
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IF, the position is indicated Which you do not |
FWIW, some data here:
http://forums.procooling.com/vbb/showthread.php?t=9445 The issue is partly the distance, and partly the diameter of the temp probe. |
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I just want to make a die sim which is as similar as possible to as many others as possible so that some sort of cross comparison can be made of any given block I might make. Right now I am using a Barton sized die, but I suspect few others are. I am fishing for some kind of "between those who are interested, standard", which I desperately hope pHaestus ends up using, since his setup will be definitive. |
Incoherent:
I agree on all counts I am inclined to go with the "copy BillA" approach, simply because he already has a fully functioning setup and he is available for discussion. |
I think pH is close to having a die made, multiple copies ?
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sure why not? The more the merrier; right? I think JFettig even volunteered to make 'em :)
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pH
I've found several missing dimensions in the die dwg I sent you, I'll need to get them the next time I have a wb change - towards the end of the week ? Les - why I did not define the RTD location/distance |
Incoherent
Are you USA. Europe or New Zealand based? Possibly all 3. Whichever, you are only occasionally stupid Far from stupid this time |
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I thought Sweden? Guess he gets around a lot though... |
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It would seem to me that lately the trend will be for larger dies with all these dual-cored CPU's on the horizon, at least until the chip mfgrs fix their shrinkage issues. >200mm^2 is near unviable though for immature processes which is what the CPU makers deal with since they are the ones pushing the boundaries more than most, so 140-160mm^2 as a middle ground? Say 12x12mm, or 12.5x12.5mm? Intel seems to like square dies lately, whereas AMD of late seem to be going highly rectangular. :shrug:
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What diameter probes are you going to use pHaestus?
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The 10x10mm seems sensible
Can be related to Bill's data Incoherent Note your update signature update, cricket and RL? |
one could consider the size as irrelevant if better units were used with "°C/W",
as in °C/W/cm² do we have any data demonstrating wb performance differences between a larger and smaller die ? (I do not, have not run as an independant variable) Cathar ? |
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Statement of die size is definrtive Using °C/W/cm² is not |
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Anybody on for a thermistor matrix in a diesim block? Could be used in reverse to analyse the (un)evenness of the heat distribution over the CPU die too. Calibrate that! |
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