Corsair COOL vs. Tt Bigwater vs Gigabyte 3D Galaxy on TweakTown
 

Linkie

Something is very wrong with their results IMO.

http://images.tweaktown.com/imageban...3way_test2.gif

Besides, the lack of a proper thermocouple, or showing what the ambient temperature was, or remounting to double check results, but honestly, it seems more like someone trying to please their distributors rather than making an honest review.

I don't know what to think honestly. I have seen a few posts from users that can't get any performance out of the kit either and there is another review here with less than desirable results: http://www.systemcooling.com/corsair_cool-07.html

Normally I would call just bad testing method but it seems like there are a few to many bad result cases.

hmmm....statistics then do seem to indicate less than desirable results. Whats the main difference between the COOL & the default Swiftech H20 kit then ? Was under the impression that nearly all the parts were the same....

http://forums.pcper.com/showthread.php?t=397079

I wonder if that could be a more wide spread problem?

I have searched the web and found many reviews. The results seems to be staggering one way or the other. It either performs very well or not well at all.

I thought that I'd add that when maximumPC reviewed the corsair kit, they didn't get very good results. I should note that their testing methodology blows. They used onboard temperature monitoring, and the closet thing they gave to empirical data was the maximum OC a system could achieve with each WC kit. Surprisingly enough, the swiftech kit outperformed its twin corsair kit! Pathetic....

How can a consumer make an informed buying decision if the community keeps feeding him/her crap?

No way in hell the Gigabyte 3D Galaxy performs better than Corsair Cool. I have a similar setup to the Corsair Cool and I know that it performs better than the 3D Galaxy.

However, SystemCooling reports that even aircooling outperforms the Corsair Cool... something is very wrong here.

Well the main difference that I can tell between the Swiftech H20-120 kit and the Corsair COOL is that the Corsair Cool's waterblock features 41 less pins (240pin) than the MCW6000 (281pin).

Even then, performance reduction shouldnt be so staggering.

Would be good if we got BillA in here for a bit

BillA already started a thread on this thing here: http://forums.procooling.com/vbb/showthread.php?t=11195

In it he claims the 240 pin is a typo and the block indeed has 281 pins.

well...guess I really am stumped for words and the slight refinements that Corsair made though not apparent aesthetically, must have had some impact on performance, etiher that or Q.C. is the issue.

I would venture to guess the mounting brackets are getting screwed up either during manufacturing or painting. I would like to get a hold of one of these kits and do a review of my own. That way I can rule out any bad peices as I know what to look for.

The SystemCooling.com reviewier also used the gpu block. It looks like a restriction monster. I think flow was reduced too much causing bad temps for the cpu.

Doh, never mind.

This seems like the best review of the Corsair Cool system I have seen so far.

The results still are not impressive though.

I didnt say it was impressive, just was a good realistic review. What kind of performance can you expect out of a single BIP and a relativly quiet/weak fan?

It also seems to me that the MCW6000 performs better on small dies rather than larger IHS cpus considering the difference that Lee got at SystemCooling and PH got here. I think that it is possible that mounting pressure could have as much to do with it as block design tho.

http://www.systemcooling.com/images/...image22big.gif

As much as I like Robo's work I don't think it is realistic at all. A 140mm die is to big. Even with a IHS this is way to big. People that know more than I agree aswell.

Also I would expect it to perform a hell of a lot better than any air cooling. Not just a C or 2 or in some reviews worst than stock cooling.

One of the folks indicating problems did determine that the hold-down was bent. Perhaps there is something in manufacturing or packaging that is resulting in poor hold-downs going out with the kit?

Yeah, see post 10 above. Wouldn't be supprized.

It's all in the writing, it's all in the writing.
When some has the title "Water Cooling Madness" the guy is out of his league.
Then states "the results speak for themselves" and the temps differences don't match up, the results are saying to me he got paid.
Anytime the site reads "Beginner to Expert" thats a redlight warning.

Reading computer parts review you got to know who's BSing it and who's for real. Sometimes it's hard to spot. Sometimes, like this one, it's really easy.

I never trust review on Wcing from sites that don't focus on WCing. These guys don't have the test setup, experience, or honesty to not take $$ or a free product and write an honest review.
Personally I wouldn't trust my own review even if I had the proper equipment because I can say I'm no expert in WCing testing and even in WCing despite a couple years experience and a several setups later.

There is another twist to this. Mounting pressures should always be roughly proportional to the mating area. Waterblock manufacturers spec springs and tensions with their equipment to be within CPU manufacturer specifications. If we now suddenly throw a CPU die that's >double the anticipated die size into the mix, then mounting pressures will then be half of what they should be.

Generally need between 7-10kgs of mounting pressure per 100mm² of mating area for good thermal contact. IHS capped CPU's deviate from this rule a little bit because the entire IHS area is not the entire CPU die thermal contact area.

That is something else to ponder for sure. I didn't even think about mounting pressure vs. die size.