They clain that 200 milliliters/m (0.2 L/m) would be enough to cool a processor, emitting 120W plus, with 500W hotspots. That's rather bold! That flow would have to be right on top of the die, in fact, that flow would have to go through the processor core, to be that effective! We've all seen direct die experiments, and they require large flow rates: even with inpingement, 1.0 gpm (60 gph, ~4 L/m) doesn't even cut it.
I just don't see it. :shrug:
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