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Originally Posted by |kbn|
Silicone is used for thermal pastes and doesnt cunduct... however I dont think sealant silicone will work well for this atall. Also cooling the mosfets will u sually cool all the other components in the area, as they dont output that much heat and but the mobo's traces do cunduct heat which takes heat away form surrounding areas.
The TO-220 package (which mosfeets use) is disigned so that the part on mosfets which is soldered to the PCB is suppost to be mounted to a heatsink. This means the mobo acting as the heatsink and disiapating the heat more than the small plastic surfact that people usually assume disipates the heat...
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that makes sense...
but one idea would be when he is all finnished he can scratch off the silicon off the plastic part of the mosfets. as long as he doesn't scratch off to much he should be ok...