It looks like they did incorporate TIM in the internal resistivity, and not a good paste at that.
Quote:
|
A high conductivity thermal paste (4.5 W/m°C) is used to accommodate slight height variations in the components and to provide a stress-free interface between the heat sink and the chip. A chip thickness of 300 m and an interface thickness of 40 m yields a totalinternal resistivity of 0.10 °C/(W/cm2).
|
What I find interesting is tailoring C/W to the "hot spot"
Quote:
|
Another advantage of the NFHS technology is that its resistivity can be tailored over the surface of the heat sink to eliminate “hot spots.” This ability is an intrinsic characteristic of normal flow heat transfer (see Section 4.) As illustrated in Figure 3, tailoring the thermal resistance to the heat dissipation provides the most effective means of eliminating potential hot spots in applications where the heat generation is highly non-uniform. The thermal resistance of the NFHS can be controlled from a low value of about 0.05°C/(W/cm2) to any higher value with a spatial resolution of about 1 mm.
|