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Originally Posted by Jabo
Well, there's also sth called spreadability and filling ratio (how fine the thing is) and AC is supposedly better.
AS5 may be better with physical properties (thermal conductivity) but application is a different ball game alltogether.
If it was better to ommit TIM in your cooling assy then nobody would be using it by now!
Direct metal-to-cilicone contact without TIM is laughable in terms of thermal transfer compared to the same thing used with TIM.
You may want to use mercury but I doubt you'd survive t tell the story  |
You're not comparing TIM vs direct contact with cpu cores though. You're comparing TIM vs air. And air is about as bad as it gets for thermal conductivty outside of say a vacuum.
If you could somehow acheive direct metal to silicon contact over the core the thermal transfer rates would be very very high compared to a normal TIM joint. Getting surfaces to match up on the microscopic level like that is nearly impossible though, and certainly far to expensive to seriously consider.
AS5 and ceramique are the best TIMs, and I'm certainly not advocating not using them. But to suggest putting a layer of AS5/ceramique in as a substitute for a real metal bond is flawed.