Ok, in an effort to find out in greater detail, the thickness of the silicon layer, on top of the actual CPU core, so that I can determine the optimal placement of the temp probe, within the copper heat die, I came across this site:
http://www.webhelp.org/jonnyguru/mis...CPUs/index.htm
While there are no dimensions, it does show that the core is actually resting on top of the ceramic substrate.
So...
According to AMD specs,
http://www.amd.com/us-en/assets/cont...docs/26237.PDF
the core exceeds the substrate by 0.80 to 0.88 mm.
Obviously there are going to be differences with the various CPUs, so I'm thinking about using another measure, such as 0.40 mm, as the silicone layer thickness. OF course this is for a different area, so I'll have to recalculate...
Let's see if I can get some more core dimensions.
In the mean time, can anyone make any sense of these thermographs?
http://homepage2.nifty.com/masamoto/DATA15.html