Hey Ben,
I'm trying to understand why you are worried about exact heater cartridge placement/spacing from the die surface?
A homogeneous block of copper is going to have very different thermal properties than a fabricated silicon wafer/IHS no matter what you do. The spacing or distance from die surface to heater centerline will affect the resultant Delta T (along with the material's Therm Cond and heat load). When using copper you can mount the heaters relatively far from the die surface and still not see too big of a Delta T - well within the limits the heaters can withstand. So what difference does it make???
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