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The next gen will probably be on .065 process, which reduces the die area on the chip to about 30 percent the size of the .09nm chip, assuming identical transistor count. So even if power output is halved on that hypothetical chip, the thermal density of the die is going to increase somewhat, ~40%.
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If they intend to get to 65 nanometers, they're going to have to change something. 90nm has been a major failure, and I think here is where we stop.
The Aquarius II is only cheap now that it is drastically outdated. The other things are expensive as hell (compared to custom or air) and not that great.
8 times better than silver's conductivity is nothing, comparitively. Heat pipes are the way to go, if processors do keep getting hotter (put that in your pipe [heehee...] and smoke it, Cooligy)