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Originally Posted by Jabo
Starman97 - you mixed everything there d00de!
Keep in mind that dies need to be small (are getting smaller as I write this) and therefore in-die cooling solutions will have to be designed to use particle physics, not fluid dynamics (how would you make it high pressure resistant, huh?)
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Actually...
. Die size is getting larger, but 2x2cm is a practical limit, it's hard to handle and package die's much bigger than this. Also thermal expansion effects create large stresses at the edges of the die-package interface.
. heat pipes run at low pressure, they're not like home or car AC units.
. Micro-machined Si is quite strong for it's size.
Have a look at this,, starting on page16 for the thermal stuff..
http://www.sematech.org/meetings/200...ng_Goodson.pdf