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Originally Posted by AngryAlpaca
Heatpipes are ultimately what will stop water from becoming mainstream, in my opinion at least.
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They are now already heavily in evidence in the SFF and mobile marketplace. The shuttle SFF's are an example, it has the ICE system as they call it.
Many people heavily into overclocking etc have had little success in improving on it by fitting conventional HSF's. OK the shuttle is limited in space to get the huge ones in but does anyone really want a 1kg weight bolted on to their mobo's.
Adding dual fans in push pull to the ICE system makes a big improvement at low cost, with improvements in design to the 'radiator' by more closer fins etc and the addition of more pipes, this could cope with a lot more watts than is currently used.
The Zalman case uses this technology of course too, but I think falls down in having too much 'still air' in their design.