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bigben2k · 05-28-2004, 09:31 PM

Ok, let's stir things up a bit...

I've come across some unsubstantiated information that states that a TEC does NOT spread heat, it carries it quite linearly.

I have to assume, for the sake of common sense and for safety, that the heat spreads would flow ******d at ~ at 45 deg angle, from the heat source (CPU die). Given a 1/4" cold plate, the two ceramic (?) layers that constitute a TEC, and a water block base plate, what's the resulting area that actually requires cooling? Is it less than a typical 40 mm by 40 mm TEC?

Here's another mystery: does the cold plate bend or flex, when clamped, and by how much? Does it impact performance?

05-28-2004, 09:31 PM	#18
bigben2k Responsible for 2% of all the posts here. Join Date: May 2002 Location: Texas, U.S.A. Posts: 8,302	Ok, let's stir things up a bit... I've come across some unsubstantiated information that states that a TEC does NOT spread heat, it carries it quite linearly. I have to assume, for the sake of common sense and for safety, that the heat spreads would flow ******d at ~ at 45 deg angle, from the heat source (CPU die). Given a 1/4" cold plate, the two ceramic (?) layers that constitute a TEC, and a water block base plate, what's the resulting area that actually requires cooling? Is it less than a typical 40 mm by 40 mm TEC? Here's another mystery: does the cold plate bend or flex, when clamped, and by how much? Does it impact performance? __________________ WBTA (Water Block Testing Alliance) Nordic Hardware WC 101