[CheeseBall]

I have been thinking about this for some time. I haven't been meditating on it as much as I should be here is what I'm thinking:

We know direct die watercooling doesn't work long term. But what if we did the following:

1) Cut a 1/32" deep pocket into the bottom center of your waterblock. The pocket being slightly smaller than the size of the die (and centered over it).

2) Then cut a small channel around your new pocket for an O-ring. For an AMD XP, you would have the O-ring a milimeter or two outside the die. So water would be able to touch the CPU's PCB, but only right next to the die. I need to find out if there is any thing electrical there. But w/ A64s and pentiums this would be alot easier.

3) Now the trouble is getting water into our pocket. The unpocketed area around the pocket will be in contact w/ the outside edge of the die after we mount the block. So to get our water in there, we drill a 1/32" hole at an angle from the highest spot on the side of our waterblock base, to the pocket. We want to start the hole on the side of the block that will be the highest side when the block, mobo, and case are in their normal position. Would would like to enter the pocket at the edge or corner, so the air in the pocket floats UP, out of our hole when we put water in it.

4) Now after we mount the block w/ the O-ring. Position the case so that our hole is on top. Then take a syringe (or something you know will work), and fill it w/ water. Then stick the syringe into your hole, and inject water slowly. Keep the perimeter of the hole surrounded w/ a towl, so when/if you fill it up to much, it doesn't make tooo big of a mess. Once the hole is filled completely, tilt the case around a little to allow any air bubbles to get out that haven't. Then make sure our hole is most of the way full still. Then plug the hole w/ whatever will work well. Finally, wipe up any spilled water and let the sytem dry for a day (if you made that big of a mess), and put some paper towels under the waterblock so you can find any obvious leaks.

5) Boot up the system and check temps right away.


So what do you guys think about this? The hardest thing will be drilling that damn small hole, and angling the hole as to not go through the O-ring channel. Any other ideas?

Since the water is not moving, it should remained sealed for as long as we want w/ out leaking. Yes? And the solid bay of water between the CPU and waterblock should beat the heck out of AS5. Yes?

And As you have already noticed, if we don't get enough water into our pocket, we are screwed. And if it leaks, we are pretty much screwd. But when did that ever stop anyone? Do you think a refined version of this would be better than both AS5 and that solder method.

Can someone post a link to the soldering method of mounting a waterblock or heatsink?