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Originally Posted by pHaestus
On a related issue, what about a diamond coating on the top of the die simulator to try and preserve its shape/size and avoid the need for constant lapping and maintenance? You could have the copper and phenolic resin be flush with one another on the top and then put a diamond sticking up to come in contact with waterblock or heatsink bps...
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Actually, air is a better insulator than the resin, by a factor of at least three (last I checked, could be wrong).
I was just thinking about a nickel plating, like the Intel IHS. Opinions?
AA: it's best to be different for now, until we can sort out all the differences. That's where the WBTA is at: wait and see...
I'm still going to go ahead with my plans to run test series on 10 by 10mm and 12 by 13mm, for a number of blocks. I should have my chiller remotely operated within a week or two.