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Originally Posted by freeloadingbum
I disagree. Water should be better at filling in the micro-crevices due to it's low viscosity, leaving less air bubbles. Also because of the ultra thin layer water will produce, it's thermal conductivity shouldn't matter much. My personal tests showed ~3C improvement compared to multiple mounts of AS3 (using cheap testing equipment of course)
I sealed the top of the processor package using a wide piece of clear tape (cutting a hole for the die) then I made a bead of dielectric grease circling the die to create an air tight seal between the processor and the bottom of the waterblock, preventing the water T.I.M. from leaking or evaporating.
I didn't do any long term tests using water as I wanted to try Fluorinert FC40 as a substitute since it's non conductive. Unfortunatly I had no luck in getting a sample.
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Water contains a lot of dissolved gases which will tend to collect on the surfaces of your cpu/block and cause much lower performance though. Just try leaving a glass of water for a day or two - you'll notice a lot of air collects on the surfaces of the glass.