Simulated Die-IHS-WB
Simulated:
Silicon die: 10 mm sq., 0.8 mm thick, 100 W distributed uniformly on the bottom.
TIMa: 35 W/(cm^2*K), based on Arctic Silver's specs
Copper IHS: 32 mm sq., 1 mm thick
TIMb: 20 W/(cm^2*k), based on ph and Cathar data
Copper Waterblock: 64 mm sq., 6 mm baseplate, h(eff)=24k over a 50 mm sq. on the top
Ambient (water): 300 K
The darn thing crashed just after the sim run, but before it ordered and grouped the data like I had wanted. 253,798 data points are sitting in no particular order.
I have a map of what's where, but it'll be a pain to assemble the bits into coherent datasets. I'm planning on these maps: temperature of the bottom of the die, heat flux at both TIM joints, temperature at top of the block (where it transitions to abstracted convection).
What do you want to see?
Last edited by Groth; 06-21-2004 at 07:29 AM.
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