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Originally Posted by Groth
I'm planning on these maps: temperature of the bottom of the die, heat flux at both TIM joints, temperature at top of the block (where it transitions to abstracted convection).
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I think these maps are a good choice.
Look forward to them.
Quote:
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Originally Posted by Groth
Copper Waterblock: 64 mm sq., 6 mm baseplate, h(eff)=24k over a 50 mm sq. on the top.
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I take it that this h(eff)=24k is equivalent to my h(bp/Fin Interface); mentioned
here .As such I have no quibble with the value.
Quote:
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Originally Posted by Groth
TIMb: 20 W/(cm^2*k), based on ph and Cathar data.
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In my opinion,
Billa and
Incoherent have the only data from which an estimate of a TIM interface's
Conductance (w/m^2*K) can be calculated.
Yes, pH's and Carhar's results can be modelled using values calculated from Billa's and Incoherent's data, but they are not the source of the values.
Quote:
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Originally Posted by Groth
TIMa: 35 W/(cm^2*K), based on Arctic Silver's specs
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. I suspect that AS's
35 W/(cm^2*K) Thermal Conductance is the Conductance of the TIM material and not of the TIM interface (My 10 W/(cm^2*K) was chosen to allow for Zero(0) Contact Resistance where as AS's 35 W/(cm^2*K) require Contact Resistance adjustment)
Apart from the above quibbles any simulation will be interesting and educational