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Originally Posted by Groth
What it's saying is that a significant portion of the heat leaves the die at the corners/edges, where the IHS is a bit cooler. I hadn't thought the silicon of the die would show much lateral heat flow, but there it is, a concept in need of pondering and experiments.
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I "get it" now. I just got a little confused as to what I was looking at was representing. Basically saying that it's easier for the heat to leave at the edges of the die than in the middle, and I wholly agree - matches up well with my own models.