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Originally Posted by zero0ne
alright as I finish installing autodesk inventor on my computer i was thinking about the ideal loop setup for this...
since the pump, 1 res and rad will be in the external case, and there will be a GPU WB, CPU, WB and another res in the case i was thinking this setup:
pump -----> CPU -> res in comp case -> GPU -----> rad -> res in ext case -> pump
the reason for this as i see it is that flow will be fastest right after the pump and if im correct, you want high flow for all the current CPU WB's it then goes to the res in teh comp case because the CPU is higher up than the GPU and the res will be at the very top to get out air bubbles... then it goes to the GPU so that there is some decent speed from gravity (not sure if gravity would help it out enough to make a difference if its even helping it out) then from the GPU to the ext case (so all that long tubing,hence the "------>" and not "->")
and to the rad when the flow is slowest (I would think) so that it has as much time to stay in the rad cooling off as possible. then to the res so it just chills there waiting for the pup to suck it down
comments on that?
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Well the flow is constant in a closed loop so you don't need to worry about posistioning things for speed. You also don't need to have a resevoir at the highest point for bubble elimination. If you only had the resevoir in the external case the bubbles would still rise to the surface when the water slowed down. Your layout minus the case resevoir would be great, although you may want to put the radiator after the pump so that it can disipate the pump's heat before it goes to the cpu.