Sighs!
Well here is my explination for those that cannot see the obvious.
I thought I might post it on [H]. Shame!
Wanto run it past you people first:
Please add to/correct this:
If a race car goes around a track at 100Km/h and spends 10 seconds on the straight/radiator what happens at 200Km/h?
He spend 5 secomds on the straight/radiator but he does it twice as often. So no matter your flow rate each water molicule spends the same amount of time in the rad, waterblock etc.
(The above needs to be credited to someone else. Dont know who?)
Flow makes a difference in 3 cases... Sorta???:
Lets say the car spend 5 seconds in the CPU waterblock S's and rises 1 deg. at 200Km/h.
At 100 he will pick up 2 deg. So when the water gets to next WB in a series loop it is hotter for low flow systems.
2:
All the inner walls in a WC loop restrict flow:
The water/air molicules sitting an a solid surface dont move.
Its called the boundry layer.
These air layers are like the layers of an onion; with each higher layer moving faster than the one underneath.
Pipe diameter reductions especially restrict flow.
Sharp edges in tube to block etc. connections cause turbulance which also slows flow (???), but is not always a bad thing:
3:
Turbulance in your CPU block can thin out the insulating boundry layer, increasing cooling efficiency. Cathar's WBs are excellent examples.
Another myth is that you should not go too high up from the pump: Go above the Max Head for the pump an flow stops!
:
Remember siphoning petrol or whatever? The weight of the fluid on the longer, downward exit pipe is heavier than that in the upward piece; so it pulls water up and flow!
So in a loop, no matter how high, the water you pump up siphons/is-pulled down in the downward bit.
Pressure increases flow by overcoming the total restriction of the complete loop. Up to a point...........??? turbulance.............???
The only place where 'pure' pump head is important to computing is with Bong Cooling.