the fet has a heatsource of almost 9*9mm, thats a small durondie, but not what i would call wickedly concentrated lol. repeatability is given in any way. just because there is no definition where to mount the sensor, its not mounted at the wrong place
I drille a hole into my copperdiesim and placed the sensor in it (you can make this sensors a lot smaller and faster with sanding off some plastic cover material). The copper diesim is connected to a real CPU, where i sanded the thin layer of plastiks away and soldered onto the copperlayers. That gives me an optimal mounting pressure and thats whats most important in testing. Iv you use sockets and mobosimulators from steel and unflexible cpus, you cannot simulate the Elasticity of the material itself and get the wrong pressure. Pressure differences kan easily make a 1-2K difference, whats much more than the differences you can get when the FET is only 9*9mm insted of the 11*11 of the AthlonXP and a 5mmthick isolated coppersim is between it... The cpu is and Palomino XP, which is a very good compromise in diesizes today. not as big as an Clawhammer but bigger than barton and prescott.
Thats only one solution. The project didn't included this standards, because diesims and cpus change time by time and this project should not be connected to any socket and any Diesize. Also the user should be free to measure the temp where he want and to measure with what he wants. for example you can also use 2, 3 or 4 tempsensors to read the cputemp if you would like it more.